铜线封装可靠性分析.pdfVIP

A b str a c t S in co the 19 50 s, the inv en t ion o f in tegr a ted c ir cu its, w ith th e con t inuou s dev e lopm en t o f m icro e lectr on ic s techno lo gy, th e p erfo rm an ce o f in tegra ted c ir cu its con t inu e to in cr ea se, w h ile th e co st o f a s ing le ch ip ha s b een dec l in ing . Th is ha s a lso led to r e la ted e lec tron ic pr odu cts w ith improved p er form ance an d dec line in th e co st in to the ten s o f thou sands of househo lds to fac ilitate peop le’ s lives. E lectron ic products, fr om hou seh o ld app l ian ce s to com pu ter s, m ob ile p hon e s, a n d b o th ar e tr u e. Integra ted c ir cu it manu fa ctur ing process is a lso r is ing, from 0. 5um to 0. 18um ，and then to todays 65nm, 22nm . Th is m akes the ch ip to comp lete th e sam e fu n ct ion a s the ar ea is g ett ing sm a ller an d sm a ller, th e co st of a s ing le ch ip is becom ing le ss and le ss. Bu t th e pa ckag ing costs, labor , m a ter ia l r ea son s ，ther e is no corre spo n d in g prop or t ion decr ea sed ，b u t th e upward tr en d b egan . A t presen t, the genera l- ch ip packag ing co sts a ccoun t for m or e than ha lf of the en t ire co st, from th e package to see th e co st o f m ater ia ls from h igh to low a s fo llow s : w ir e ， p lan ter box es, p la st ic, rubb er an d s ilver pa s te. C ondu c tor m a ter ia ls u sed in packag ing m a ter ia ls - go ld in th e ba ck drop o f in f la t ion , pr ico s ar e a lso r is ing, an d m ark e t tr en d s o f the corr espon d ing ch ip pr ices ar e fa lJ ing . U nder th is pr essure, w e ur gen t ly n eed to f in d th e go lden thr ea d o f a lterna t ive pr o du ct s. B eg inn ing in th e 19 70 s，peop le began to u se copp er in stea d o f go ld thr ea d. A ft