SMT设备原理与应用.pptVIP

solder paste serves not only as a solder material, but also as a glue. the deposition of solder paste is usually conducted by the stencil or screen printing, dispensing, or pin-transferring processes. The premetered deposition of solder material onto the sites to be soldered ensures a consistent solder volume for the joints, and accordingly eliminates the insuf?cient solder volume problems due to the shadowing effect encountered by wave soldering. In addition, this premetered solder deposition also reduces the incidence of bridging. Advantages of solder paste technology in SMT the use of mass re?ow process allows a well-controlled graduate heating pro?le, thus eliminating potential damage of the SMCs due to the thermal shock caused by the wave soldering the use of solder paste allows the possibility of step soldering. the soldering performance of solder paste is not sensitive to the type of solder mask used on the PCBs. For the wave soldering process, a solder mask with a smooth ?nish is found to cause solder ball and bridging problems . Advantages of solder paste technology in SMT 技术发展趋势 Surface mount technology trends Technology driving force Smaller Faster Higher complexity Lower power Lower cost Speed processing speed increases approximately ?ve times in every 5 years; results from reduction in both on-chip delay in semiconductors and packaging delay this improvement in speed is closely associated with miniaturization of IC components, as demonstrated by the simultaneous reduction in line widths SMT设备原理与应用Principle and Application of SMT Equipment 2010.9 本课程主要讲述内容，时间安排，考试安排，实验，辅导和平时考勤 SMT工艺流程和相关设备 SMT设备概述 Summarize SMT概述与发展趋势 4学时 summary and trend 焊膏组成与印刷的方式 4学时 solder paste composition and printing technology 印刷机原理与应用 6学时 principle and application of printer 贴片机原理与设备 12学时 principle an