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- 2025-12-12 发布于北京
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SCM协议下美国芯片产业补贴政策的国际合规性研究
[中图分类号]D996[文献标识码]A[文章编号]1671-8372(2025)02-0067-09
StudyontheinternationalcomplianceofUSchipindustrialsubsidypolicyundertheAgreementonSubsidiesandCountervailingMeasures
YANGMeng-sha,LIUXing-yue(LawSchool,TianjinUniversity,Tianjin30oo72,China)
Abstract:Withthelocalizationandregionalizationtransformationofglobalsupplychains,majoreconomiesworldwidehaveprioritizedthesecurityandautonomyofsupplychainstoaddresstheriskofdisruptionsarisingfromthehighinterdependenceofglobalsupplychains.Asthechipindustryisatthecoreoftechnologicalcompetition,theU.
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