Cellular Automata Simulation of Gap-Filler Dissolution during Transient Liquid Phase Bonding of Single Crystal Materials英文文献资料.docVIP

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Cellular Automata Simulation of Gap-Filler Dissolution during Transient Liquid Phase Bonding of Single Crystal Materials英文文献资料.doc

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Cellular Automata Simulation of Gap-Filler Dissolution during Transient Liquid Phase Bonding of Single Crystal Materials英文文献资料

Modeling and Numerical Simulation of Material Science, 2012, 2, 15-27 15 /10.4236/mnsms.2012.22002 Published Online April 2012 (http://www.SciRP.org/journal/mnsms) Cellular Automata Simulation of Gap-Filler Dissolution during Transient Liquid Phase Bonding of Single Crystal Materials Adam Ghoneim, Olanrewaju Akanbi Ojo * Department of Mechanical and Manufacturing Engineering, University of Manitoba, Winnipeg, Canada * Email: olanrewaju.ojo@ad.umanitoba.ca Received December 15, 2011; revised January 28, 2012; accepted February 9, 2012 ABSTRACT A new numerical model is developed using a Cellular Automata (CA) method to study the liquid-phase dissolution be- havior of gap-filler powder particles in interlayer powder mixture during transient liquid phase (TLP) bonding process. The model prediction of microstructural evolution in TLP joint between single crystal substrates show that formation of misoriented stray-grains results from incomplete liquation of the gap-filler powder particles. In contrast to what is gen- erally assumed and reported, numerical calculations coupled with experimental verification show that under properly selected process parameters, complete melting of the gap-filler powder particles is possible. This is imperative to pre- vent the formation of misoriented stray-grains and maintain single crystallinity during TLP bonding of single crystal materials. The dependence of complete melting of the gap-filler particles on salient TLP bonding parameters are ana- lyzed and discussed. Keywords: Cellular Automata; Transient Liquid Phase Bonding; Single Crystal; Powder Dissolution 1. Introduction and Background alloy, rich in melting-point depressant (MPD) solute, is sandwiched between two solid base materials and the entire assembly is heated to the bonding temperature. At the bonding temperature, the filler alloy melts and rap- idly attains equilibrium at the liquid-solid interfaces through bas