薄膜技术教学资料-03Thin-Film Evaporation.pptVIP

3.3 The way to achieve thickness uniformity Locate both the surface evaporant source and the substrates on the surface of a sphere rotation 3.3 The way to achieve thickness uniformity h↑, l↓, rotate sample 3.3 The way to achieve thickness uniformity Ring-shape source 3.4 CONFORMAL COVERAGE OF STEPS AND TRENCHES When a film of the same thickness coats the horizontal as well as vertical surfaces of substrates, we speak of conformal coverage. (left) Schematic illustration of film coverage of stepped substrate. A, Uniform coverage; B, poor sidewall coverage; C, lack of coverage—discontinuous film, (right) Formation of a keyhole void in a high aspect ratio via during sputtering. 3.5 FILM PURITY Impurities in Source Contaminate the source from the heater, crucible, or support materials Residual gases 3.5 FILM PURITY Effect of residual gass In high vacuum system, the deposited Al film is silvery white. In the low vacuum conduction, the Al film is dark, but it can be silvery white again with increasing deposition rate. Why? Effect of residual gass The content of residual gas in thin film Ф: deposition ratio of residual gas G: deposition ratio of evaporator P: pressure of residual gas 3.5 FILM PURITY beam splitters光束分离器 * Ascendancy统治权；支配力量 * Stringent严格的 * hydrostatic pressure液静压,液体静压力 exert运用；施加 * rule of thumb经验法则, 靠经验估计 * Emanates 发出 * Ag 961.93℃, Al 660.4℃, 1Pa饱和蒸汽压的加热温度Al 1150, Ag 1050 ,Al熔点比Ag低, 蒸发温度Al比Ag高 * Deep, narrow crucibles with large n have been employed to confine evaporated radioactive materials to a narrow angular spread in order to minimize chamber contamination. * 提问 * Technology of Thin Film Thin-Film Evaporation Processes Xuhai Zhang School of Material Science and Engineering Southeast University Outline Introduction The Physics and Chemistry of Evaporation Film Thickness Uniformity and Purity Evaporation Hardware Evaporation Processes and Applications Conclusion * Introduction Thermal energy is imparted to atoms