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CHARACTERIZATION OF THE THERMOSONIC (描述的超声波热)
SAND74-0411
Unlimited Release
CHARACTERIZATION OF THE THERMOSONIC
WIRE BONDING TECHNIQUE
D. R. JOHNSON AND E. L. CHAVEZ
When printing a copy of any digitized SAND
Report, you are required to update the
markings to current standards.
Issued by Sandia Laboratories, operated for the United States Energy
Research and Development Administration by Sandia Corporation .
NOTICE
This report was prepared as an account of work sponsored by
the United States Government. Neither the United States nor
the United States Energy Research and Development Admini-
stration, nor any of their employees, nor any of their contrac-
tors, subcontractors, or their employees, makes any warranty,
express or implied, or assumes any legal liability or responsibility
for the accuracy, completeness or usefulness of any information,
apparatus, product or process disclosed, or represents that its use
would not infringe privately owned rights_
S.AlID74-0411
CHARACTERIZATION OF THE THERMOSONIC
WIRE BONDING TECHNIQUE
D. R. Johnson and E. L. Chavez
Sandia Laboratories
Albuquerque, New Mexico 87115
January 1976
ABSTRACT
This study WFJ.S designed to evaluate the combination of ultrasonic energy and
thermocompression techniques, i.e., thermosonic bonding, with regard to the bond
response of thin film substrate metallization and thick film discrete component
terminations. The object was to determine not only the quality of thermosonic
gold wire bonds and the performance
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