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挤压铸造sicpaz91镁基复合材料的显微结构与性能-microstructure and properties of extruded sic paz 91 magnesium matrix composites.docx

挤压铸造sicpaz91镁基复合材料的显微结构与性能-microstructure and properties of extruded sic paz 91 magnesium matrix composites.docx

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挤压铸造sicpaz91镁基复合材料的显微结构与性能-microstructure and properties of extruded sic paz 91 magnesium matrix composites

摘要采用挤压铸造法成功的制备 了增强体粒径分别为 5μm 、 20μm 和 50μm,体积分数均为 50%的 SiCp/AZ91 镁基复合材料。采用扫描电镜(SEM) 和透射电镜(TEM)对材料的显微组织进行了观察;测试了材料的室温与高温 性能;通过 SEM 动态原位拉伸试验研究了复合材料的断裂过程;采用热膨 胀仪(DIL)和动态机械分析仪(DMA)对材料的热膨胀性能和阻尼性能进行了 测定。研究结果表明复合材料中存在有大量的细小、不连续的界面反应物,经 衍射环标定为 MgO。这些界面反应物主要来自挤压铸造时粘结剂与熔融的 镁反应。这些 MgO 与碳化硅颗粒之间存在一定的位向关系,结合强度较 高。所以,适量的界面反应有利于界面结合,改进复合材料的性能。与基体合金相比,复合材料的力学性能(常温拉伸性能和高温拉伸性能) 和物理性能(热膨胀性能和阻尼性能)均有较大程度的提高。三种复合材料中,增强体 SiC 颗粒的粒径越小,复合材料具有更高的力 学性能和更低的热膨胀系数,而阻尼性能越低。力学性能高是由于小粒径的 SiCp/AZ91 复合材料的强度是由基体本身的性质和界面结合强度控制;大粒 径的 SiCp/AZ91 复合材料的强度是由 SiC 颗粒自身的断裂控制。热膨胀系 数低是由于增强体粒径越小,SiCp-Mg 界面面积越大,增强体对基体的约束 作用越大。阻尼性能低是由于增强体粒径小的复合材料相比增强体粒径大的 复合材料内部的可动位错少。复合材料的断裂行为模式主要为:界面控制机制、应力集中机制和基体 控制机制。关键词碳化硅颗粒;镁基复合材料;界面;性能AbstractSiCp/AZ91 magnesium matrix composites with three particle sizes of 5μm, 20μm and 50μm were fabricated by squeeze casting technique, the volume fraction of them was 50% in all cases. The microstructures of the materials were examined by means of scanning electron microscope (SEM) and transmission electron microscope (TEM). The room temperature and high temperature mechanical properties of the composites were studied, and the fracture behavior of the composite was investigated by in-situ SEM observation. The thermal expansion behavior was examined by dilatometer (DIL) and the damping capacity was evaluated by dynamic mechanical analysis (DMA).The results showed that, a lot of fine discrete interfacial reaction products were observed at the SiCp-AZ91 interface, and the interfacial reaction product is MgO confirmed by the ring diffraction pattern. These interfacial reaction products are mainly from the reaction between the binder and the melted magnesium. There exists a definite orientation relationship between MgO and SiC particle, the strength of combination is comparatively high. So, modest interfacial reaction is beneficial to interfacial bonding between SiCp and Mg matrix, resulting in an improvement of the mechanical properties.Compared with the matrix alloy, the mechanical properties (a

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