微量银对sn-0.7cu钎料性能及界面结构的影响-effect of trace silver on properties and interface structure of sn - 0.7 cu brazing filler metal.docxVIP

重庆理 重庆理工大学硕士学位论文 万方数据 万方数据 摘 要 多年来，锡铅钎料合金以其良好的润湿性、抗腐蚀性、导电性及其合理的价格广 泛地应用于电子工业。然而由于铅具有毒性，对环境有污染，随着立法限制和技术要 求的提高，研制新型实用的无铅钎料替代传统的 Sn-Pb 钎料已成为近年来研究的热 点。本文以 Sn-0.7Cu 共晶合金为研究对象，添加微量 Ag 元素，制备了 4 种不同成分 的（Sn-0.7Cu）-xAg 无铅钎料合金。通过差热分析、力学性能的测定、漫流性和电化 学腐蚀实验，考察了合金元素 Ag 对钎料合金性能的影响，结果表明： 添加 Ag 能同时降低钎料合金的固相线和液相线温度，且对液相线温度的影响比 较显著。添加 Ag 能改善液态 Sn-0.7Cu 钎料在铜表面的漫流性。在 270℃下，当 wAg = 0.3%时其漫流性可上升 1.8%左右。当 Ag 含量在 0.9wt%的范围内，随 Ag 含量的增 加，钎料的抗拉强度呈现出先增大后降低的规律，当 wAg =0.6wt%时，其拉伸强度达 到最大值 32MPa，但其塑性则随 Ag 含量的增加而一直下降。 研究发现，钎焊时，Ag 并未进入界面金属间化合物层，在（Sn-0.7Cu）-xAg/Cu 界面仅生成 Cu6Sn5，界面 IMC 的形貌随 Ag 含量的变化而变化。当 Ag 含量较低时， 界面 IMC 起伏较大，在界面的 IMC 插入钎料基体内部较深。由于 IMC 向钎料中延 伸，使界面金属间化合物层的厚度极不均匀，最厚和最薄相差达数倍。随着 Ag 加入 量的增加，当 wAg≥0.6wt%时，界面 IMC 的起伏逐渐变小而呈平坦的连续相，其 IMC 的厚度逐渐变得均匀化。 关键词：无铅钎料；（Sn0.7Cu）-xAg；力学性能；金属间化合物 I ABSTRACT Lead-tin(Pb-Sn) solder alloys have been widely used in the modern electronics industry because their low melting points, good wettability, good corrosion resistance ， good electrical conductivity and reasonable price. However, due to the toxicity of lead and its alloys, increasing environmental and health concerns and legislation restriction over the use of lead, Whats more, the development of packaging technology need developing solder alloys withstanding good mechanics properties as well as electrical properties. As far now, designing new lead-free solders is a hot spot of recent researches. The effect of adding a small amount Ag on properties of the Sn-0.7Cu based alloy was studied., and the interface microstructure between solder and Cu substrate was studied in present paper .Many kinds of their properties such as melting points, mechanics properties, overflow-ability, corrosion resistance were studied by experiments, the effect of the different composition on the properties was provided as follow: The addition of Ag can reduce melting temperature of the solders. The Ag content of solder has significantly influenced on liquidus temperature of solders. The addition of Ag can improve the overflow-ab