基于oee方法的半导体封装测试产能提升研究管理科学与工程专业论文.docxVIP

Abstract II STUDY ON PRODUCTION CAPACITY IMPROVEMENT OF SEMICONDUCTOR ASSEMBLY AND TEST BASED ON OEE ABSTRACT As the semiconductor assembly and test industry need to invest a lot of expensive equipment, coupled with fast product updates bring the equipment updates requirement, companies have a huge of financial pressure and cost burden. Therefore need to find capacity and feasible method of improve overall equipment effectiveness, improve the effective production capacity and control costs, to reduce product cost, promote enterprise develop in the fierce market competition. This study with enhance the capacity as the end result, and the QFP production line of A semiconductor assembly and test company for the study object, research idea to start in three parts. First, apply the TOC method to find the bottleneck process of QFP production line ,in order to eliminate the bottleneck process constraints for production capacity, to collect the production status data of production equipment , according to the method of OEE classified stop loss time and establishing OEE model. Second, against the three major factors of causing for the loss of OEE in the model, application of fish-bone diagram to do causal analysis, find out primary and secondary causes of resulting in the loss, made the point improvement plan and formulate improvement program against of the three largest loss of OEE. Third, implementing improvement programs, conduct special improvements for downtime, with fish-bone diagram and FMEA method to focus on improvement; lead into the TPM management, implement specific measures to reduce planned maintenance downtime; do optimization process with the IE method to shorten the change time of production batches, respectively achieved encouraging improvement results. Through the implementation of improvement programs, evaluation of results, OEE losses reduced by 8.3%, production capacity upgraded 290 thousands, achieved very good direct and indirect benefits. Have achi