《材料力学性能》英文课件part 2 Plastic deformation and Strain hardening.ppt

Deformation mechanisms, operating in nanocrystalline materials at a more refined level, are described by lattice dislocations and creep invoking atomic level phenomena. Here, even though it is commonly assumed that one deformation mechanism dominates in practice, several mechanisms may simultaneously contribute to plastic flow. A grain size distribution must be taken into account in calculation of the yield stress as the averaged (over grain sizes) value with different deformation mechanisms acting in grains with sizes being in different ranges. Most nanocrystalline metals while exhibiting enhanced yield strength often have a reduction in ductile strength. An attractive processing route for enhancing the ductility of high-strength nanocrystalline metals and alloys is to develop a bimodal grain size distribution, in which, supposedly, the finer grains provide strength, and the coarser grains maintain or even enhance ductility. This is schematically shown in Fig. 8. In practice, Wang et al. [128] first reported a successful application of this concept in nanostructured, ultrafine-grained Cu. They rolled the Cu to 93% at liquid nitrogen temperatures and then annealed it at low temperatures, up to 200 C. The annealing treatment optimized strength and ductility producing a mixture of nano-scale, ultrafine grains (80–200 nm) along with about 25% volume fraction of coarser grains (1–3 lm). The coarser grains were probably the result of secondary recrystallization (see also Ma [129]). Effect of temperature on the flow stress 1--Al-3%Cu, coarse particle 2--Al-3%Cu, fine particle 3--Solid solution containing 0.104% Cu Problems A single crystal in the form of a cube has two possible slip planes, (1) and (2), as shown in the sketch below. Each of these planes has two possible slip directions, (a) and (b), as is also shown. a. If a stress is applied to this crystal in the direction noted, specify which particular (e.g., plane (1), direction (a)) slip system(s) will be activ