SMT返修工艺及要求.docVIP

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南京信息职业技术学院

毕业设计论文

作者徐耀华学号21623D32

系部机电学院

专业电子组装技术与设备（对口单招）

题目SMT返修工艺及要求

指导教师余日新陈冬兰

评阅教师

完成时间：2019年月日

毕业设计(论文)中文摘要

题目：SMT返修工艺及要求

摘要：随着SMT技术在产品制造中的广泛应用，实现了电子产品组装的高密度、小型化、自动化的生产方式。但是往往在焊接之后，其成品率不能达到100%，会有多多少少的出现一些缺陷。在这些缺陷中，有些属于表面缺陷，影响焊点的表面外观，不会影响产品的使用功能与寿命，可根据实际情况决定是否需要返修；但有一些缺陷，如偏移、桥接、少件等，会严重影响产品的使用寿命及功能，此类缺陷必须进行返修或返工。而对于各种元器件的返修工艺都是截然不同的，所以，选择不同的返修工艺去消除缺陷、采用合适的返修工具是我们需要探讨的重点。

关键词：缺陷返修工艺工具

毕业设计(论文)外文摘要

Title:ReworkprocessesandrequirementsforSMT

Abstract:WiththewideapplicationofSMTtechnologyinproductmanufacturing,Theproductionmodeofhigh-density,miniaturizationandautomationforelectronicproductassemblyisrealized.Butaftersoldering,Itsyieldcannotreach100%,andtherewillbemoreorlessdefects.Someofthesedefectsbelongtosurfacedefects,whichaffectthesurfaceappearanceofsolderjointsanddonotaffecttheservicefunctionandlifeoftheproducts.Itcanbedecidedwhetheritneedstoberepairedaccordingtothefactsituation.However,somedefects,suchasdeviation,bridging,lackofcomponents,willseriouslyaffecttheservicelifeandfunctionoftheproduct,suchdefectsmustberepairedorreworked.Astherepairingprocessesofvariouscomponentsareentirelydifferent,soweshouldchoosedifferentrepairingprocesstoeliminatedefectsandadoptappropriaterepairingtoolsisthefocusofourdiscussion.

keywords:defectrepairprocesstool

目录

1引言··················································1

2SMT综述···············································1

2.1SMT及其组成·········································1

2.2SMT生产设备及组成···································2

2.3SMT的工艺流程·······································3

3SMT返修工艺及设备·····································4

3.1SMT返修