SMT贴装工艺流程及贴装的缺陷分析.docVIP

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南京信息职业技术学院

毕业设计论文

作者蒋奇男学号21623D39

系部机电学院

专业电子组装技术与设备（对口单招）

题目SMT贴装工艺流程及贴装的缺陷分析

指导教师余日新蒋芸

评阅教师

完成时间：2019年月日

毕业设计(论文)中文摘要

题目：SMT贴装工艺流程及贴装的缺陷分析

摘要：此篇文章是根据我在校进行的专业课程学习，论述SMT贴装的工艺流程和缺陷的检测分析。对于SMT来说最重要的就是贴装的工艺和质量。一旦出现缺陷，不能准确、及时的改进，很有可能导致整个生产过程出现问题，更有可能造成企业的严重损失。本文主要论述了SMT贴装设备的原理和生产工艺，以及一些贴装过程中常见的一系列缺陷问题，并进行有效地改进和优化生产工艺和生产管理。本文通过对SMT的介绍、生产、工艺流程、贴装在SMT里的主要作用和影响，便于提高SMT的生产效率和减少成本。

关键词：SMT工艺流程贴装缺陷

毕业设计(论文)外文摘要

Title:Assemblyprocessanddefectanalysisin

SMT

Abstract:Thisarticleisbasedonmyprofessionalcoursesinschool,discussSMTmountingprocessanddefectdetectionandanalysis.ThemostimportantthingforSMTisthemountingprocessandquality.Oncetherearedefects,theinaccurateandtimelyimprovementmayleadtoproblemsinthewholeproductionprocess,andevenmorelikelytocauseseriouslossestoenterprises.ThispapermainlydiscussestheprincipleandproductionprocessofSMTmountingequipment,aswellasaseriesofcommondefectsintheprocessofmounting,andeffectivelyimprovesandoptimizestheproductionprocessandproductionmanagement.ThispaperintroducesSMT,production,processflow,themainroleandinfluenceofSMTmounting,whichisconvenienttoimproveSMTproductionefficiencyandreducecosts.

keywords:SMTprocessassemblydefect

目录

1引言··················································1

2SMT的概述·············································1

2.1SMT的工艺流程·······································2

2.2SMT贴装的工艺流程···································2

2.3SMT贴装的工艺要求···································5

2.4SMT贴装的工作原理···································5

3SMT贴装常见的质量缺陷及解决方法·······················9

3.1漏贴················································9

3.2偏移···············································10

3.3桥接·····