添加剂铝对铜基金刚石复合材料性能的影响.docVIP

  添加剂铝对铜基金刚石复合材料性能的 影响 李龙波，郭世柏，宋宇峰** 5 10 （湖南科技大学机电学院，湖南 湘潭 411201） 摘要：铜基金刚石复合材料是一种新型功能材料，具有耐高温、高导电、导热性良好的物理 性能。广泛应用于电子封装材料和信息领域。本文采用粉末冶金法制备铜基金刚石复合材料， 为了改善铜和金刚石的相容性，添加了少量的铝以改善铜和金刚石的相容性。研究了添加剂 的含量、烧结工艺对复合材料组织和性能的影响。实验结果表明，在真空气氛下，添加剂铝 的含量为 0.8wt%的铜基金刚石复合材料在 920烧结 2h 具有较好的综合性能。材料的致密 度为 94.89%，抗弯强度为 783MPa，硬度为 93kgf/mm2，断口形貌为韧性断裂。在 480保 温 3h 热处理后，发现材料的综合性能得到改善，组织更加均匀。 关键词：铜基金刚石复合材料；力学性能；微观组织 中图分类号：TG 15 The Effection Of Additive Al To Cu/diamond Composite Material Property LI Longbo, GUO Shibo, SONG Yufeng (Hunan University of Science and Technology, HuNan XiangTan 411201) 20 25 30 35 40 Abstract: Cu/diamond composite material is a new kind of functional material with good physical properties such as: high temperature,good electrical conductivity and thermal conductivity. It is applied in the fields of electronic packaging and information technology.Cu/diamond composite materials was prepared by powder metallurgy. A small amount of Al was added into the composite materials to improve the compatibility between the Cu and diamond. Effect of the content of additive Al and sintering processing on microstructure and mechanical properties was investigated. The results showed that the best content of Al was 0.8wt% and the optimum sintering process was at 920℃ for 2h.The composite materials had a comprehensive properties. It had a relative density of 94.89%,bending strength 783MPa, hardness 93kgf/mm2.The fracture morphology of the composite materials showed ductile fracture. After heat treatment at 480℃ for 3h, the comprehensive performance of the material was improved and micro structure became uniform. Keywords: Cu/diamond composite material; mechanical properties; microstructure 0 引言 金属基复合材料起源于 20 世纪 50 年代末期或 60 年代初期。在过去的二十多年中，金 属基复合材料逐渐地从军事国防向民用领域渗透，如今已在陆上运输、民航、工业和体育休 闲产业等诸多领域实现商业化的应用。 随着信息化时代的迅速发展，对现代电子元器件集成度和运行速度的要求越来越高，相 应功耗也越来越大，这必然会导致电路发热量的提高，从而使工作温度不断上升[1-7]。一般 来说，在半导体器件中，温度每升高 18，失效的可能性就增加 2～3 倍。另外温度分布不 均匀将会使电子元器件的噪音大大增加。为解决这些问题，开发低成本、低膨胀、高导热、 易加工、可靠性高的电子封装材料