封装常见材料参数.docVIP

元器件封装常见材料参数 Elastic Properties of Metallic Elements Used In Electronic Packaging Metal Condition E(Elastic)(GPa) G(Shear)(GPa) Tensile Strength(MPa) Yield Strength*(MPa) Aluminum 99.996 Annealed 68.9 26.5 47.4 12.2 Antimony 77.8 11 Copper 99.997 Rod, cold-drawn 127.7 46.8 351 340 Gold 99.99 Cast 74.4 124 Lead 99.90 Rolled, aged 9.5 (0.5 %) Molybdenum Pressed, sintered sheet 340 690 Nickel 99.0 Wrought, annealed 210 482 138 Platinum 99.99 Annealed 147 120-130 Silver Strained 5 %, heated 5 hr at 350 C 71 – 78 Tin Pure, cast 41 – 45 21.4 Tin-5Ag Sheet, aged at room temp. 31.7 24.8 Tungsten 340 135 Zinc 0.10 Pb Hot-rolled strip 134-160 Material Properties of a Via-in-Pad Chip-Scale Package Printed Circuit Board Assembly Property Material Young’s Modulus(GPa) Poisson’s Ratio(nu) Thermal Expansion Coefficient (alpha)(10-6/K) FR-4 epoxy-glass PCB substrate 22 0.28 18.5 Copper VIP(via-in-pad) 76 0.35 17 Sn-37Pb (eutectic) solder E=32.0-0.088·t (0 = t = 100, t is Celsius temp.) 0.4 21 Underfill 6 0.35 30 Silicon chip 131 0.3 2.8 Solder mask 6.9 0.35 19 *Al 69 0.33 22.8 *Si3Ni4 314 0.33 3 Micro-via filler 7 0.3 35 Bismaleimide Triazene (BT) 26 0.39 Elastic Properties and Thermal Expansion Coefficient of Electronic- Packaging Materials and Lead Solder Alloys Material Temp.(oC) Young’s Modulus, (GPa) Poisson’sbrRatio (n ) Thermal Exp.Coefficient (10-6/K) Sn-37Pb (eutectic) solder -7020140 38.130.219.7 0.40.40.4 24.024.024.0 Pb-10Sn -5522100 13.49.784.91 0.40.40.4 27.828.930.5 Alumina (substrate) -5522100 303303303 0.210.210.21 3.94.56.7 Silicon chip -73 27127 162162162 0.220.220.22 1.402.623.23 Polyimide PWB -55 to125 14.5 0.16 13.0 HysolFP4526Underfill -73255277102127 9.789.519.238.827.725.37 0.30.30.30.30.30.3 33.033.033.033.033.033.0