高导热低介电氮化铝聚酰亚胺纳米复合薄膜的制备与性能研究-信息材料专业论文.docxVIP

北京化工丈学硕士研究生毕业论文 高导热低介电氮化铝／聚酰亚胺纳米复合薄膜 的制备和性能研究 摘要 微型化已经成为印刷线路板和电子封装材料发展的主要方向之 一，聚合物基电子封装材料在电子器件封装应用中具有广阔前景。在 实际电工和电子应用领域中，除了考虑电介质材料具有低的介电常数 外，还必须尽可能使其具有较大的热导率，以满足线路板和器件日益 增大的导热(散热)需求。 本实验通过将高导热的纳米氮化铝(n-A／N)通过机械搅拌分散和 球磨分散工艺加入到新鲜合成的聚酰亚胺(PI)中以提高纳米复合薄膜 的导热系数。采用丫一氨丙基--7,氧基硅烷偶联剂(aJ-i550)对n．A1N粒 子表面进行物化处理，以提高有机一无机两相界面的结合力。采用 TEM、SEM、TGA、阻抗分析仪和导热分析仪对材料的微观结构、热 性能、电性能等进行了研究。结果显示无机粒子在纳米复合薄膜中分 散均匀，导???系数由纯聚酰亚胺的0．16 W／m·K提高到0．36 w／m·K， 同时使介电常数保持在4以下。而且，球磨工艺得到的薄膜的性能要 远远优于机械搅拌得到的薄膜性能。这样的材料在电子封装材料和印 刷线路板中具有很大的应用前景。 关键词：纳米复合薄膜，聚酰亚胺， 氮化铝，导热系数，介电性能  北京化工人学硕士研究生毕业论文 PREPARATIoN AND PRoPERTIES oF ALUMINUM NITRIDE／PoLYIMlDE NANoCoMPoSlTE FILMS WITH HIGH THERMAL CoNDUCTIVITY AND LOW DIELECTRIC PERMITTIVlTY ABSTRACT Nowadays，the micromation is mainly one of the development aspects of printed circuit board(PCB)and the package of electronic components． The polymer-based electronic package material has been proved to be promising for use in the package of electronic components．In the actual application of the electric and electronic domain，dielectric materials require not only low dielectric permittivity but also high thermal conductivity SO that they Can satisfy the increasing thermal diffusion of PCB and the package of electronic components。 To improve the thermal conductivity of the polyimide(PI)films， aluminum nitride nanoparticle(n-AIN)with high thermal conductivity itself was dispersed into the PI by mechanical stirring and by ball—milling with planetary mill respectively．丫-aminopropyl triethoxysilane(KH550) was used as a coupling agent for encapsulating inorganic nanoparticles．  北京化工大学硕士研究生毕业论文 TEM、SEM、thermal constants analyzer、impedance analyzer were used to characterize the microstructures and measure the thermal and dielectric properties of the achieved AIN／PI nanocomposite films．The results showed that the de—agglomeration of the encapsulating AIN nanoparticles was clearly observed by TEM．The thermal conductivity ofthe film increased to 0．35 W／m·K in comparison with thermal con