关于提高芯片ICS模块良品率的研究-电子与通信工程专业论文.docxVIP

ABSTRACT For the semiconductor devices final test, the manufactory have to run the test flows at different temperature include cold, hot and room to make sure all modules of the devices can work well at the full temperature range as mentioned in datasheet. And after a new device safe launched to manufactory, if no unit from huge loading failed at room test, manutactory can eliminate the room test from the safe launch flows to get the manufactory test capacity improvement, but at least the cold test and the hot test were necessary for the semiconductor products test, especially for the devices which will be used for automotive. The study object of this paper is about ICS (Internal Clock Source) module of Freescale HCS08 SG32/16 series. SG32/16 devices under 2 final test insertions at both cold and hot, and always had the ICS test low yield issue at the 2nd final test insertion (hot test). As a special function, Freescale S08 series have an ICS trim register which can modify the frequency of ICS module output by write different value into it. This paper studied the correlation between the ICS output frequence, test temperature and the trim value of ICS trim regiester to understand the root cause of the low yield. Base on the study, product engineer get an idea to make the test yield improvement and keep stable: At the 1st final test insertion (cold test), test program will verify multi ICS trim value and all of them should make the unit pass the 1st final test insertion, and at the 2nd final test insertion (hot test), the test program will select the one which can make sure the unit pass the 2nd insertion test, so the final trim value can support the unit pass both the 1st and the 2nd test insertion. The final trim value will be record into the flash for customer reference and it can make sure the ICS module works well at the full temperature range. The new test method had been released to manufactory and lots of SG32/16 units had been tested with the new method, the