晶圆传输机器人末端运动及晶圆接触状态检测系统分析-analysis of wafer transfer robot end movement and wafer contact state detection system.docxVIP

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晶圆传输机器人末端运动及晶圆接触状态检测系统分析-analysis of wafer transfer robot end movement and wafer contact state detection system.docx

晶圆传输机器人末端运动及晶圆接触状态检测系统分析-analysis of wafer transfer robot end movement and wafer contact state detection system

AbstractIntegrated circuit (IC) industry is the core power in /dict_result.aspx?searchword=%e6%8e%a8%e5%8a%a8%e7%bb%8f%e6%b5%8e%e5%8f%91%e5%b1%95amp;tjType=sentenceamp;styleamp;t=promoting%2Beconomic%2Bdevelopmentpromoting economic /dict_result.aspx?searchword=%e6%8e%a8%e5%8a%a8%e7%bb%8f%e6%b5%8e%e5%8f%91%e5%b1%95amp;tjType=sentenceamp;styleamp;t=promoting%2Beconomic%2Bdevelopmentdevelopment in which wafer transfer robot is the key manufacturing equipment . It’s rapidity and stability directly determines the efficiency of IC industry. Due to the common characteristics of serial non-direct drive robot, position feedback of the joint motor can’t truly reflect the motion of robot ends. In addition, there exists stick-slip between end-effector and wafer due to acceleration and deceleration. Both of them affect the stability, reliability, and efficiency of wafer transmission. According to the problems above, a sensing system to detect is needed.Supported by the national 973 sub-project “ Principle and realization oftransferring large scale and super thin wafer with high efficiency and stabilization under complex environment” (granted No.2009CB724206), the topic carries out thestudy on a sensing system for the motion of wafer transfer robot ends and the wafer contact state. The solution for detecting the position, speed and wafer stick-slip is put forward. The sensing principles of each part are analyzed in detail. Each detection module is designed and produced and the principle of each module is experimentally verified.Firstly, wafer transfer robot model is established and the transfer trajectory planning and kinematics simulation on the typical operation positions is carried out. The whole scheme of the detection system is proposed. The preliminary analysis on the basic principle of each sensing modules is accomplished, including wafer contact state detection based on stick-slip sensor, end position detection based on the two-dimensional PSD and end velocity est

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