光刻机双工件台轨迹规划算法分析-analysis of trajectory planning algorithm for lithography machine dual workpiece stage.docxVIP

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光刻机双工件台轨迹规划算法分析-analysis of trajectory planning algorithm for lithography machine dual workpiece stage.docx

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光刻机双工件台轨迹规划算法分析-analysis of trajectory planning algorithm for lithography machine dual workpiece stage

哈哈尔滨工业大学工学硕士学位论文哈哈尔滨工业大学工学硕士学位论文 PAGE PAGE IVIIIIIIAbstractProduction is one of the three major technical indicators of lithography, the increasing of production rate will bring high economic value, so production is todays focus of the field of semiconductor manufacturing equipment. In the complete process of exposure of silicon wafer, wafer stage will have scanning step and exchange motion, the quality of trajectory of the wafer stage and exposure scanning path directly affect the lithography’s production efficiency. As a result, it’s necessary to design a reasonable trajectory for the whole movement process of wafer stage. This thesis studied on three issues in the motion of wafer stage: route planning of wafer scanning trajectory planning of scanning and step motion and the optimal control problem in the process of wafer stage exchanging.Firstly, planned the path of the wafer scanning process, refined the mathematical model of the problem, and translated this issue into traveling salesman problem, and then take advantage of genetic algorithm optimization design the problem, finally used MATLAB simulation to solve the problems of the wafer scanning path planning. The total distance which using this method to optimal scanning path planning is decreased by 4.86% than traditional scanning method, which effectively improve the production rate of lithography.Secondly, planned the trajectory of lithography’s step and scanning motion, then analyzed motion trajectory of S-curve in detail, and the implementation algorithm of different order S-curve is deduced, then designed different order S-curve for the scanning movement, designed the time-impact optimal 5-order S-curve for the stepping motion. Then optimized the process of the whole movement path of lithography, analyzed the methods of the wafer stage exchanging, and then designed a time optimal bang-bang control method and time-impact the optimal control method for the point-to- point movement in the process of wafer