射频磁控溅射法制备tio2薄膜及其n掺杂改性tio2-xnx薄膜研究-study on preparation of tio _ 2 thin films and n - doped modified tio _ 2 - xnx thin films by radio frequency magnetron sputtering.docxVIP

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射频磁控溅射法制备tio2薄膜及其n掺杂改性tio2-xnx薄膜研究-study on preparation of tio _ 2 thin films and n - doped modified tio _ 2 - xnx thin films by radio frequency magnetron sputtering.docx

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射频磁控溅射法制备tio2薄膜及其n掺杂改性tio2-xnx薄膜研究-study on preparation of tio _ 2 thin films and n - doped modified tio _ 2 - xnx thin films by radio frequency magnetron sputtering

3.53evto3.42evand3.24ev;andtheTiO2-xNxfilmsbasedonK9glass,opticalbandgapwerereducedfrom3.4evto3.1evand2.7ev.Keywords：TiO2;RFmagnetronsputtering;Ndoping;X-rayphotoelectronspectroscopy;UV-Visspectra;Ramanspectra目录第一章绪论··············································································································11.1引言················································································································11.4.1溅射沉积······························································································81.4.2化学气相沉积······················································································81.4.3溶胶凝胶法························································································101.5TiO2掺杂改性研究111.5.1金属沉积及金属阳离子掺杂·····························································贵金属沉积·················································································金属阳离子掺杂·········································································121.5.2非金属离子掺杂················································································12N掺杂12S的掺杂14C的掺杂141.6本文研究背景及主要内容··········································································151.6.1选题意义····························································································151.6.2本文研究内容····················································································15第二章TiO2薄膜制备及其测试分析······································································162.1磁控溅射法制备TiO2薄膜·········································································162.1.1溅射机理及其特点············································································162.1.2磁控溅射原理····················································································172.1.3磁控溅射TiO2薄膜制备工艺192.2测试分析方法······························································································20扫描电子显微镜（scanningelectronmicroscope,SEM）20X射线衍射(X-rayDiffraction,XRD)212.2.3紫外可见光谱分度计·············