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W-10%Ti合金的制备工艺研究-材料学专业论文
哈尔滨
哈尔滨工业大学工学硕士学位论文
哈尔滨
哈尔滨工业大学工学硕士学位论文
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- PAGE IV-
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- PAGE III -
Abstr act
Thin W-Ti films have many great significant properties such as thermomechanical stability, low electromigration and high corrosion resistance etc., which make these films convenient as interdiffusion barriers for metallic contacts of semiconductor devices. Naturally, the quality of the film depends on the microstructure of W-Ti alloy.
In this study, the preparation of W-Ti alloy as sputtering target was explored. W-10wt%Ti alloys were fabricated by hot-pressing W-Ti mixed powders under vacuum condition. Then XRD, SEM, EDS, TEM were used to analyze the microstructure of the alloy, density and hardness were also tested in order to analyze the correlation between microstructure and properties. The milling process of W-Ti powder and the sintering process including temperature, pressure and annealing were studied systematically.
The morphology of mixed powder was affected by milling methods. The mixed powder particles were greatly refined through high energy ball milling, and a mutual solid solution between W and Ti was achieved. This is not found for conventional ball milling. Using the WC balls as the milling media, layered structure of Ti particles was formed. In contrast, for the resin milling balls, original powder characteristics were matained.
Powders obtained by different milling process were sintered at the same condition (1400oC, 30MPa, 1 h), and a great discrepancy was observed in W-Ti alloys. Alloys prepared by high energy ball milling powder show a uniform structure of fine grain size, and Ti-rich phase has a size of 2μm or less. In contrast, alloy sinstered by powders that prepared by general ball milling with WC balls comprised a structure with a strip-shaped Ti-rich phase about 40μm in
length. And powders prepared by general ball milling with resin balls formed a structure consisting a pure Ti phase in the centre of the Ti-rich phase.
W-Ti alloys were fabricated with powders th
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