Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate英文文献资料.docVIP

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Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate英文文献资料.doc

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Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate英文文献资料

HindawiPublishingCorporation ActiveandPassiveElectronicComponents Volume2011,ArticleID823654,8pages doi:10.1155/2011/823654 ResearchArticle ApplicationofThermalNetworkModeltoTransientThermal AnalysisofPowerElectronicPackageSubstrate MasaruIshizuka, TomoyukiHatakeyama, YuichiFunawatashi, andkatsuhiroKoizumi 1 1 1 2 1 2 DepartmentofMechanicsSystemEngineering,ToyamaPrefecturalUniversity,Imizu939-0398,Japan COSELCO.LTD.,1-6-43Kamiakae-machi,Toyama930-0816,Japan CorrespondenceshouldbeaddressedtoMasaruIshizuka,ishizuka@pu-toyama.ac.jp Received12April2011;Revised4August2011;Accepted6September2011 AcademicEditor:P.MarkondeyaRaj Copyright?2011MasaruIshizukaetal. This is an open access article distributed under the Creative Commons Attribution License,whichpermitsunrestricteduse,distribution,andreproductioninanymedium,providedtheoriginalworkisproperly cited. In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements.Thehigherthedensityscaleis,thelargerthepowerdissipationperunitareabecomes.Therefore,inthedesigning process,ithasbecomeveryimportanttocarryoutthethermalanalysis.However,theheattransportmodelinmultichipmodules isverycomplex,anditstreatmentistediousandtimeconsuming.Thispaperdescribesanapplicationofthethermalnetwork methodtothetransientthermalanalysisofmultichipmodulesandproposesasimplemodelforthethermalanalysisofmultichip modulesasapreliminarythermaldesigntool.Onthebasisoftheresultoftransientthermalanalysis,thevalidityofthethermal networkmethodandthesimplethermalanalysismodeliscon?rmed. 1.Introduction methodologycoinedbuild-upapproach(BUA)andhaveap- pliedittotheboard-andbox-levelthermalanalyses.Min- ichielloandBelady[6]proposedathermaldesignmethod- ology and applied it to the design of a multi-processor